Danny Banks's
Introduction to MICROENGINEERING
MEMS Micromachines MST

Basic techniques

There are three basic techniques associated with silicon micromachining. These are the deposition of thin films of materials, the removal of material (patterning) by wet chemical etchants, and the removal of material by dry etching techniques. Another technique that is utilised is the introduction of impurities into the silicon to change its properties (ie, doping). Doping is only mentioned very briefly below.

It should be noted that all the techniques are outlined very briefly. Behind each outline hides a number of different methods, each with different advantages and disadvantages.



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Copyright D Banks 1999. All rights reserved.
ueng@dbanks.demon.co.uk
26 April 1999